Detail Specifications 

 
Frequency 
 3400 MHz

Turbo frequency
 3900 MHz

Clock multiplier
 34

Package
 1155-land Flip-Chip Land Grid Array

Socket
 Socket 1155 (Socket H2)   


 
Architecture / Microarchitecture
 Microarchitecture:Ivy Bridge
 Processor core :Ivy Bridge
 Manufacturing process:0.022 micron
 Data width:64 bit
 The number of cores:4
 The number of threads:8
 Floating Point Unit:Integrated   


 
 Level 1 cache size: 
 4 x 32 KB instruction caches
 4 x 32 KB data caches
 Level 2 cache size:4 x 256 KB
 Level 3 cache size:8 MB shared cache
 Multiprocessing:Uniprocessor   


 
Features: 
 1.MMX instruction set 
 2.SSE 
 3.SSE2 
 4.SSE3 
 5.Supplemental SSE3 
 6.SSE4.1 
 7.SSE4.2
 8.AES instructions 
 9.Advanced Vector Extensions 
 10.Extended Memory 64 technology (EM64T) 
 11.Execute disable bit 
 12.HyperThreading technology
 13.Turbo Boost technology 2.0 
 14.Virtualization technology (VT-x) 
 15.Virtualization technology (VT-d) 
 16.Trusted Execution technology   


 
On-chip peripherals
 1.Dual-channel DDR3 memory controller 
 2.PCI Express 3.0 interface 
 3.HD 4000 graphics controller 

Thermal Design Power 
 77 Watt   


 
 Item Dimension (L"xW"xH"):
 4.49 x 3.19 x 4.02 

Weight:
1 lb

 Warranty Information:
 3 Years